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Sustainable Void Fill Solutions

FillPak TT®

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FillPak TT®: fast and optimal void fill, and seamless integration

FillPak® paper packaging material provides an effective way to fill empty spaces in a box, preventing your products from shifting around during transit. As a clean, efficient, reliable, and flexible solution, it is dispensed on-demand at high volumes, so less packaging material is required. No matter what size of box or type of product you are shipping, Ranpak has the paper packaging solution for you.

The FillPak TT® (Table Top) converter forms single-ply, fanfold kraft paper into a PaperStar™ configuration that maximizes paper volume. The result is a fast and effective void-fill material that protects products during shipment. Packing efficiency can be maximized by placing a FillPak TT® converter at several packing stations, speeding operations and saving on material use and cost. The converter is operated easily using a foot pedal, and it dispenses void-fill material directly into a box ensuring maximum throughput.

Specifications

Converter

  • Cut Method: Manual tear
  • Weight: 17 lbs.
  • Dimensions: 17″ x 21″ x 13″

Good to know

Fast on-demand dispensing at high volumes, and easy to install at all locations.

Added Value

Packaging Engineering

Ranpak will analyze your current packaging solution and perform a drop test, demonstrating how much shock is transmitted to your products through the packaging. Ranpak then suggests proper packaging techniques to improve protection and save costs.

Integrated Applications

The Ranpak Custom Engineering department can design modifications, customizations and other innovative solutions to integrate the packaging converter anywhere around, above or under a packing area.

Packaging Training

Training from our packaging experts can help your packers use up to 20% less packing material without compromising the quality of the packaging.

Popular In These Industries

Ranpak is at MODEX 2022

Atlanta | March 28 – 31

Visit us at the
Caja Robotics booth: #C3789

We look forward to seeing you there.

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March 20-23 | Chicago, IL